Total: 90
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
TR,CT
pipe
pallet,pallet
256Mb(16M x 16)
512Mb(32M x 16)
1Gb(64M x 16)
2Gb(256M x 8)
1Mb(128K x 8)
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
64Mb(4M x 16)
128Mb(8M x 16)
16Mb(512K x 32)
32Mb(1M x 32)
2.7V ~ 3.6V
1.7V ~ 2V
2.3V ~ 3.6V
1.65V ~ 3.6V
1.65V ~ 2V
1.65V ~ 2.75V
-40°C ~ 85°C(TA)
-40°C ~ 125°C(TA)
-40°C ~ 85°C(TC)
-40°C ~ 145°C(TA)
40 MHz
25ns
70ns
85ns
95ns
15ms,5ms
75ns
105ns
110ns
8-SOIC(0.154 ,3.90mm wide)
5ms
63-VFBGA
mould
8-SOIC(0.154,3.90mm wide)
8-WDFN Exposed Pad
56-TFSOP(0.724,18.40mm wide)
80-BQFP
80-LBGA