Total: 54
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
pipe
1Mb(128K x 8)
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
512Kb(64K x 8)
2Mb(256k x 8)
2.7V ~ 3.6V
2.3V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI
1.65V ~ 1.95V
-40°C ~ 85°C(TA)
80 MHz
104 MHz
8-XFBGA,WLCSP
8-UFBGA,WLCSP
800µs
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
8-UFDFN Exposed Pad
8-DIP(0.300,7.62mm)