Total: 8
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
32Mb(8M x 4)
64Mb(16M x 4)
64Mb(8M x 8)
SPI - Four I/O
SPI - Four I/O,QPI
2.65V ~ 3.6V
-40°C ~ 85°C(TA)
133 MHz
8-SOIC(0.154 ,3.90mm wide)
24-TBGA,CSPBGA
8-WDFN Exposed Pad