Total: 41
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
256Mb(32M x 8)
512Mb(64M x 8)
1Gb(256M x 4)
2Gb(512M x 4)
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
128Mb(16M x 8)
32Mb(8M x 4)
64Mb(8M x 8)
2.7V ~ 3.6V
2.3V ~ 3.6V
1.65V ~ 3.6V
SPI - Four I/O
1.65V ~ 2V
2.65V ~ 3.6V
-40°C ~ 85°C(TA)
108 MHz
133 MHz
33 MHz
80 MHz
104 MHz
8-SOIC(0.154 ,3.90mm wide)
24-TBGA,CSPBGA
24-TBGA
8-WDFN Exposed Pad
8-UDFN Exposed Pad