Total: 7
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
32Mb(4M x 8)
128Mb(16M x 8)
64Mb(16M x 4)
64Mb(8M x 8)
2.7V ~ 3.6V
SPI - Four I/O,QPI
1.65V ~ 2V
2.65V ~ 3.6V
-40°C ~ 85°C(TA)
133 MHz
8-WDFN Exposed Pad