Total: 37
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
TR,CT
pipe
256Mb(32M x 8)
512Mb(64M x 8)
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
128Mb(8M x 16)
512Kb(64K x 8)
1.7V ~ 1.95V
2.7V ~ 3.6V
2.3V ~ 3.6V
1.65V ~ 3.6V
SPI - Four I/O
1.65V ~ 2V
-40°C ~ 85°C(TA)
108 MHz
45ns
8-SOIC(0.209 ,5.30mm wide)
8-SOIC(0.154 ,3.90mm wide)
16-SOIC(0.295 ,7.50mm wide)
8-XFBGA,WLCSP
8-UFBGA,WLCSP
31-UFBGA,WLCSP
8-TSSOP(0.173 ,4.40mm wide)
24-TBGA
8-WDFN Exposed Pad
8-UFDFN Exposed Pad
56-TFBGA,CSPBGA