Total: 285
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
256Mb(16M x 16)
1Mb(128K x 8)
2Mb(256K x 8,128K x 16)
4Mb(512K x 8)
4Mb(512K x 8,256K x 16)
8Mb(1M x 8)
8Mb(1M x 8,512K x 16)
16Mb(2M x 8)
16Mb(2M x 8,1M x 16)
32Mb(2M x 16)
32Mb(4M x 8)
32Mb(4M x 8,2M x 16)
64Mb(4M x 16)
128Mb(16M x 8)
128Mb(16M x 8,8M x 16)
256Mb(32M x 8,16M x 16)
8Mb(512K x 16)
16Mb(1M x 16)
64Mb(8M x 8)
64Mb(8M x 8,4M x 16)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
0°C ~ 70°C(TA)
-40°C ~ 125°C(TA)
-20°C ~ 85°C(TA)
70ns
48-TFSOP(0.724 ,18.40mm wide)
32-TFSOP(0.724 ,18.40mm wide)
56-TFSOP(0.724 ,18.40mm wide)
64-LBGA,CSPBGA
48-LFBGA,CSPBGA
48-TFBGA,CSPBGA
48-WFBGA,CSPBGA
44-SOIC(0.496 ,12.60mm wide)
63-TFBGA
48-TFSOP(0.724,18.40mm wide)
32-LCC(J feedthrough)
32-TFSOP(0.724,18.40mm wide)
47-TFBGA
48-TFBGA
56-TFSOP(0.724,18.40mm wide)
64-LBGA
64-TBGA
46-TFBGA
46-VFBGA
48-TFSOP(0.173,4.40mm wide)
56-TFBGA,CSPBGA
64-TFBGA