Total: 162
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
TR,CT
pipe
256Mb(32M x 8)
256Mb(64M x 4)
512Mb(64M x 8)
1Gb(128M x 8)
2Gb(256M x 8)
1Mb(128K x 8)
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
128Mb(16M x 8)
512Kb(64K x 8)
64Mb(8M x 8)
SPI - Four I/O
SPI - Four I/O,QPI
SPI - Four I/O,QPI,DTR
SPI - Four I/O,DTR
SPI - two I/O
1.65V ~ 2V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
0°C ~ 70°C(TA)
-40°C ~ 125°C(TA)
120 MHz
70 MHz
200 MHz
166 MHz
40 MHz
50 MHz
75 MHz
108 MHz
133 MHz
80 MHz
104 MHz
90ns
8-SOIC(0.209 ,5.30mm wide)
8-SOIC(0.154 ,3.90mm wide)
16-SOIC(0.295 ,7.50mm wide)
48-LFBGA,CSPBGA
24-LBGA,CSPBGA
8-XFBGA,WLCSP
12-UFBGA,WLCSP
12-XFBGA,WLCSP
14-XFBGA,WLCSP
48-TFBGA,CSPBGA
16-UFBGA,WLCSP
23-UFBGA,WLCSP
48-XFBGA,WLCSP
31-UFBGA,WLCSP
68-XFBGA,WLCSP
24-TBGA
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
8-TSSOP(0.173,4.40mm wide)
8-UDFN Exposed Pad
8-UFDFN Exposed Pad
8-XFDFN Exposed Pad
10-XFBGA,WLCSP