Total: 1071
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
TR,CT
pipe
bulk,pallet
256Mb(32M x 8)
256Mb(64M x 4)
512Mb(64M x 8)
1Gb(64M x 16)
1Gb(128M x 8)
1Gb(256M x 4)
2Gb(128M x 16)
2Gb(256M x 8)
2Gb(512M x 4)
4Gb(512M x 8)
2Gb(256M x 8)(NAND),1G(32M x 32)(LPDDR2)
2Gb(256M x 8)(NAND),2G(64M x 32)(LPDDR2)
4Gb(256M x 16)
4Gb(512M x 8)(NAND),2G(64M x 32)(LPDDR2)
8Gb(1G x 8)
1Mb(128K x 8)
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
128Mb(16M x 8)
128Mb(8M x 16)
512Kb(64K x 8)
32Mb(8M x 4)
64Mb(16M x 4)
64Mb(8M x 8)
1.7V ~ 1.95V
2.7V ~ 3.6V
1.7V ~ 2V
2.3V ~ 3.6V
4.5V ~ 5.5V
1.65V ~ 2.2V
1.65V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI
SPI - Four I/O,QPI,DTR
SPI - Four I/O,DTR
SPI - two I/O
ONFI
1.65V ~ 2V
2.35V ~ 3.6V
2.65V ~ 3.6V
2.25V ~ 2.75V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-25°C ~ 85°C(TA)
0°C ~ 70°C(TA)
-40°C ~ 125°C(TA)
-40°C ~ 125°C
-30°C ~ 85°C(TA)
86 MHz
120 MHz
70 MHz
45 MHz
200 MHz
533 MHz
166 MHz
40 MHz
50 MHz
75 MHz
108 MHz
133 MHz
33 MHz
66 MHz
80 MHz
104 MHz
16 ns
22 ns
20ns
25ns
30ns
70ns
90ns
120ns
15ms,5ms
45ns
55ns
100ns
110ns
8-SOIC(0.209 ,5.30mm wide)
8-SOIC(0.154 ,3.90mm wide)
16-SOIC(0.295 ,7.50mm wide)
48-TFSOP(0.724 ,18.40mm wide)
32-TFSOP(0.724 ,18.40mm wide)
24-TBGA,CSPBGA
56-TFSOP(0.724 ,18.40mm wide)
64-LBGA,CSPBGA
48-LFBGA,CSPBGA
24-LBGA,CSPBGA
8-XFBGA,WLCSP
8-UFBGA,WLCSP
12-UFBGA,WLCSP
12-XFBGA,WLCSP
14-XFBGA,WLCSP
22-UFBGA,WLCSP
48-TFBGA,CSPBGA
16-UFBGA,WLCSP
48-WFBGA,CSPBGA
44-SOIC(0.496 ,12.60mm wide)
23-UFBGA,WLCSP
48-XFBGA,WLCSP
31-UFBGA,WLCSP
68-XFBGA,WLCSP
8-DIP(0.300 ,7.62mm)
48-TFSOP(0.488,12.40mm wide)
8-TSSOP(0.173 ,4.40mm wide)
650µs
24-TBGA
63-VFBGA
8-WDFN Exposed Pad
32-LCC(J feedthrough)
8-UDFN Exposed Pad
8-UFDFN Exposed Pad
48-VFBGA
56-TFBGA,CSPBGA