Total: 1513
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
bulk
pallet
TR
box
TR,CT
pipe
bulk,pallet
pallet,pallet
TR,bulk
bulk,pipe
TR,TR,CT
pipe,pipe
bulk,bulk,pallet
bulk,pallet,pallet
256Mb(16M x 16)
256Mb(32M x 8)
256Mb(64M x 4)
512Mb(32M x 16)
512Mb(64M x 8)
1Gb(64M x 16)
1Gb(128M x 8)
2Gb(128M x 16)
2Gb(256M x 8)
1Mb(128K x 8)
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
16Mb(2M x 8,1M x 16)
32Mb(4M x 8)
32Mb(4M x 8,2M x 16)
64Mb(4M x 16)
128Mb(16M x 8)
128Mb(16M x 8,8M x 16)
128Mb(8M x 16)
256Mb(32M x 8,16M x 16)
512Kb(64K x 8)
512Mb(64M x 8,32M x 16)
1Gb(128M x 8,64M x 16)
64Mb(8M x 8)
64Mb(8M x 8,4M x 16)
2Gb(256M x 8,128M x 16)
2Mb(256k x 8)
4Mb(512k x 8)
256Kb(32K x 8)
512Mb Flash Memory,64Mb RAM
256Mb Flash Memory,64Mb RAM
1.7V ~ 1.95V
2.5V ~ 3.6V
2.7V ~ 3.6V
1.7V ~ 2V
1.7V ~ 3.6V
2.3V ~ 3.6V
3V ~ 3.6V
1.65V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI
SPI - Four I/O,QPI,DTR
SPI - Four I/O,DTR
1.65V ~ 2V
2.65V ~ 3.6V
1.65V ~ 1.95V
-40°C ~ 105°C(TA)
120 MHz
200 MHz
83 MHz
100 MHz
166 MHz
75 MHz
108 MHz
133 MHz
66 MHz
80 MHz
104 MHz
30ns
60ns
8ms,2.8ms
3ms
16-SOIC(0.295 ,7.50mm wide)
48-TFSOP(0.724 ,18.40mm wide)
5ms
30µs,800µs
60µs,5ms
24-TBGA
48-TFSOP(0.724,18.40mm wide)
63-VFBGA
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
32-LCC(J feedthrough)
56-TFSOP(0.724,18.40mm wide)
64-LBGA
64-TBGA
8-TSSOP(0.173,4.40mm wide)
8-UDFN Exposed Pad
8-UFDFN Exposed Pad
24-LBGA
32-TFSOP(0.488,12.40mm wide)
48-VFBGA
56-VFBGA
48-TSOP
8-XFDFN Exposed Pad
8-XDFN Exposed Pad
8-WFDFN Exposed Pad
8-SOIC
24-VBGA
64-FBGA(9x9)
24-BGA(6x8)
56-TSOP
8-WLGA