Total: 2948
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
bulk
pallet
TR
TR,CT
pipe
bulk,pallet
pallet,pallet
TR,CT,bulk
TR,bulk
bulk,pipe
TR,TR,CT,CT
pipe,pallet
TR,TR,CT
TR,TR
pipe,pipe
bulk,bulk,pallet
bulk,pallet,pallet
256Mb(16M x 16)
256Mb(32M x 8)
512Mb(32M x 16)
512Mb(64M x 8)
1Gb(64M x 16)
1Gb(128M x 8)
2Gb(128M x 16)
4Mb(512K x 8)
8Mb(1M x 8)
8Mb(1M x 8,512K x 16)
16Mb(2M x 8)
16Mb(2M x 8,1M x 16)
32Mb(2M x 16)
32Mb(4M x 8)
32Mb(4M x 8,2M x 16)
64Mb(4M x 16)
128Mb(16M x 8)
128Mb(16M x 8,8M x 16)
128Mb(8M x 16)
256Mb(32M x 8,16M x 16)
512Mb(64M x 8,32M x 16)
16Mb(512K x 32)
32Mb(1M x 32)
64Mb(8M x 8)
64Mb(8M x 8,4M x 16)
2Gb(256M x 8,128M x 16)
512Mb Flash Memory,64Mb RAM
256Mb Flash Memory,256Mb DDR DRAM
256Mb Flash Memory,64Mb RAM
128Mb Flash Memory,64Mb RAM
2Mb(256M x 8)
-
1.7V ~ 1.95V
2.7V ~ 3.6V
1.7V ~ 2V
3V ~ 3.6V
1.65V ~ 3.6V
1.65V ~ 1.95V
1.65V ~ 2.75V
-40°C ~ 85°C
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-25°C ~ 85°C(TA)
-25°C ~ 85°C
0°C ~ 70°C(TA)
-40°C ~ 125°C(TA)
-55°C ~ 125°C(TA)
0°C ~ 85°C(TA)
-40°C ~ 145°C(TA)
200 MHz
83 MHz
100 MHz
166 MHz
40 MHz
75 MHz
108 MHz
133 MHz
54 MHz
66 MHz
80 MHz
104 MHz
65 MHz
56 MHz
85 MHz
76 MHz
84-TFBGA
24-TBGA
48-TFSOP(0.724,18.40mm wide)
mould
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
56-TFSOP(0.724,18.40mm wide)
64-LBGA
8-UDFN Exposed Pad
44-VFBGA
48-VFBGA
56-VFBGA
80-BQFP
80-LBGA
133-VFBGA
48-TSOP
80-VFBGA
84-VFBGA
8-WFDFN Exposed Pad
8-SOIC
16-SOIC
24-VBGA
8-WSON(6x8)
64-FBGA(9x9)
24-BGA(6x8)
8-WSON(5x6)
80-PQFP(14x20)
48-FBGA(8.15x6.15)
64-FBGA(13x11)
44-FBGA(7.5x5)
56-TSOP
Contact pad
8-WLGA
56-SOP(0.524,13.30mm wide)
64-VFBGA
0404