Total: 350
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
bulk
pallet
TR
TR,CT
pipe
bulk,pallet
pallet,pallet
TR,CT,
256Mb(32M x 8)
512Mb(64M x 8)
1Mb(128K x 8)
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
8Mb(1M x 8,512K x 16)
16Mb(2M x 8)
16Mb(2M x 8,1M x 16)
32Mb(4M x 8)
128Mb(16M x 8)
128Mb(8M x 16)
64Mb(8M x 8)
2Mb(256k x 8)
1Mb(128k x 8)
4Mb(512k x 8)
SPI - Four I/O
SPI - Four I/O,QPI
SPI - Four I/O,QPI,DTR
1.65V ~ 1.95V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
133 MHz
80 MHz
104 MHz
3ms
8-XFBGA,WLCSP
8-UFBGA,WLCSP
12-UFBGA,WLCSP
800µs
5ms
30µs,800µs
60µs,5ms
24-TBGA
48-TFSOP(0.724,18.40mm wide)
63-VFBGA
mould
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
8-UFDFN Exposed Pad
48-VFBGA
80-VFBGA
8-XFDFN Exposed Pad
8-XDFN Exposed Pad