Total: 433
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT
256Mb(16M x 16)
256Mb(32M x 8)
512Mb(32M x 16)
512Mb(64M x 8)
1Gb(64M x 16)
1Gb(128M x 8)
1Mb(128K x 8)
2Mb(256K x 8)
2Mb(256K x 8,128K x 16)
4Mb(512K x 8)
4Mb(512K x 8,256K x 16)
8Mb(1M x 8)
8Mb(1M x 8,512K x 16)
16Mb(2M x 8)
16Mb(2M x 8,1M x 16)
32Mb(2M x 16)
32Mb(4M x 8)
32Mb(4M x 8,2M x 16)
64Mb(4M x 16)
128Mb(16M x 8)
128Mb(16M x 8,8M x 16)
128Mb(32M x 4)
128Mb(8M x 16)
256Mb(32M x 8,16M x 16)
512Kb(64K x 8)
512Mb(64M x 8,32M x 16)
1Gb(128M x 8,64M x 16)
16Mb(4M x 4)
32Mb(8M x 4)
64Mb(16M x 4)
64Mb(8M x 8)
64Mb(8M x 8,4M x 16)
2.7V ~ 3.6V
1.7V ~ 2V
2.3V ~ 3.6V
3V ~ 3.6V
4.5V ~ 5.5V
1.65V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI
SPI - two I/O
1.65V ~ 2V
2.65V ~ 3.6V
1.65V ~ 1.95V
2.1V ~ 3.6V
1.65V ~ 2.1V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
-40°C ~ 125°C
-40°C ~ 85°C(TC)
86 MHz
0°C ~ 85°C(TA)
100 MHz
166 MHz
40 MHz
50 MHz
52 MHz
75 MHz
108 MHz
133 MHz
33 MHz
54 MHz
66 MHz
80 MHz
104 MHz
120 MHz
85 MHz
60ns
70ns
85ns
90ns
95ns
8ms,2.8ms
8ms,5ms
15ms,5ms
55ns
65ns
75ns
3ms
8ms,1ms
15ms,3ms
15ms,7ms
8-SOIC(0.154 ,3.90mm wide)
8-XFBGA,WLCSP
23-UFBGA,WLCSP
8-UDFN
24-TBGA
48-TFSOP(0.724,18.40mm wide)
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-VDFN Exposed Pad
8-WDFN Exposed Pad
15-XFBGA,WLCSP
16-SOIC(0.295,7.50mm wide)
23-XFBGA,WLBGA
32-LCC(J feedthrough)
40-TFSOP(0.724,18.40mm wide)
44-SOIC(0.496,12.60mm wide)
47-TFBGA
48-TFBGA
56-TFSOP(0.724,18.40mm wide)
64-LBGA
64-TBGA
8-UDFN Exposed Pad
8-UFDFN Exposed Pad
8-XFBGA,CSPBGA
48-VFBGA
56-VFBGA
64-TFBGA
80-LBGA
8-XFDFN Exposed Pad
8-WFDFN Exposed Pad
10-XFBGA,WLCSP